Chip packaging technology 
related topics: Soldering,
Digital: technology,
PCB fabrication |
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Applications for Silicone Materials in IC Packaging pdf
file |
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Ball Grid Array
Ball Grid Array, BGA |
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BGA Packages
BGA Packages, pdf
file |
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CSP Socket
Primer |
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Chip packaging technology
Wafer Level Chip Size Packaging Technology, pdf
file |
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Dual
In-Line Package Ceramic Dual-in-Line Package (Cerdip), pdf
file |
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Electronic packaging Overview of Electronic Packaging, Semiconductor
Packaging, Manufacturing of PWB's, Electrical Aspects of PCBs, Joining Methods
in Electronics, Surface Mounting Technology, Quality Management in PWB
Manufacture, PWB Design Process |
| IC logos
IC logos, Identification of IC manufacturer by logo |
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IC Package Families |
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IC Package information DIP (Dual-in-line Package), SDIP (Skinny Dual-in-line
Package), SDIP (Shrink Dual-in-line Package), ZIP (Zig-Zag In-line Package), SOP
(Small Outline Package), SSOP (Shrink Small Outline Package), TSOP (Thin Small
Outline Package), QFP (Quad Flat Package), LQFP (Low Profile Quad Flat Package),
TQFP (Thin Quad Flat Package), SOJ (Small Outline J-lead), QFJ (Quad Flat
J-lead), BGA (Ball Grid Array), FBGA (Fine Ball Grid Array), FLGA (Fine Land Grid Array),
W-CSP (Wafer-level Chip Size Package), TCP (Tape Carrier Package) |
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IC packages
data handbook Through-Hole Mount Packages, Surface Mount Packages, |
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IC Packaging
Packaging the IC chip is a necessary step in the manufacturing process because
the IC chips are small, fragile, susceptible to environmental damage, and too
difficult to handle by the IC users. In addition, the package acts as a
mechanism to “spread apart” the connections from the tight pitch (center to
center spacing of two parallel conductors) on the IC die to the relatively wide
pitch required by the Printed Circuit Board (PCB) manufacturer, pdf
file |
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IC Packaging click right to See a demonstration
on various features of IC Packaging design capabilities, Laminate BGA, Flex BGA,
Chip Scale BGA, Enhanced or Cavity BGA, Wafer Scale BGA |
| IC packaging
information IC packaging information, pdf
file |
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IC packaging technology ppt file |
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IC packaging technology IC packaging technology, Area Array package,
FBGA/FLGA, T-BGA, Enhanced P-BGA, P-BGA, Flat package, QFP, LQFP, TQFP, TSOP,
TSSOP, HSOF, SOP, SSOP, SOJ, DIP, SIP, SZIP, SDIPIC packaging technology, pdf
file |
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Intel packaging
technology pdf
file |
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Intel packaging
technology An overview of package families, including package attributes,
package types, and a package selection guide: FCBGA, PBGA MDDS, BGA, PGA MDDS,
QFP MDDS, SOP MDDS, CSP, Chip Scale Packaging, Plastic Ball Grid Array package
technology, Plastic Pin Grid Array package technology, and its physical
structure, Tape Carrier Package, ESD/EOS precautions, Physical constants of IC
package materials, pdf
file |
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Intel
Processor Package Type Guide There are several package types for Intel®
processors. These different package types are illustrated below along with a
brief explanation of how to easily identify them |
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Microelectronic design
Silicon microelectronic fabrication process and packaging |
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Package information SAMSUNG Semiconductor products |
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Package outline drawings pdf
file |
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Package Terminology |
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Package
outline drawings BGA, DBS, DIL, DIP, DQFN, DHVQFN, DHXQFN, HBCC, HDIP, HSOP,
HTSSOP, HUQFN, HVQFN, HVSON, HWQFN, HWSON, HXQFN, HXSON, LFBGA, LQFP, MicroPak™,
NanoStar™, PicoGate, PLCC, QFP, QSOP, RBS, SIL, SO, SSOP-II, SSOP-III, TFBGA,
TQFP, TSSOP-I, TSSOP-II, TVSOP, VFBGA, VSO, VSSOP, XQFN, XSON |
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Packages Index BGA (Ball Grid Array), CBGA (Ceramic), FCBGA, PBGA (Plastic),
SBGA (w/Heatsink), CSP (Chip Scale Package), CSP BGA (Ball Grid Array), LFCSP
(LeadFrame), LGA (Land Grid Array), Tape CSP BGA, WLCSP (Wafer Level), DIP (Dual
Inline Package), CerDIP (Ceramic), CerDIP - Side or Bottom Brazed, DIP Gullwing
Leads, Metal or Hybrid DIP, PDIP (Plastic), FlatPack, Ceramic Flat Package, QFP
(Quad Flat Pack), CQFP (Ceramic), LQFP 1.4mm thick, LQFP w/heat sink, MQFP, MQFP
- Thermally Enhanced, TQFP (Thin, 1.0mm), TQFP - Thermally Enhanced, SIP (Single
Inline Package), SIP Horizontal Leads, SIP Vertical Leads, SOIC (Small Outline
IC), PSOP (SOIC w/heatslug), SOIC (Narrow), SOIC (Wide), SOP (Small Outline
Package), MSOP (micro-SOP), QSOP (25mil pitch), SSOP (Shrink SO), Thermally
Enhanced [PSOP/2], TSSOP (Thin, 1.2mm), TSSOP_EP, SOT (Small Outline
Transistor), SC-70, SOT-143, SOT-223, SOT-23, SOT-66, SOT-89, TSOT-23 (Thin,
0.9mm) |
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Packaging
the importance of packaging (electrical and thermal), material, manufacturing
and reliability issues in the design and manufacturing of electronic products |
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Semiconductor packaging pdf
file |
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Semiconductor Packaging Assembly Technology pdf
file |
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SMD marking codes
SMD codebook: This HTML book is designed to provide an easy means of device
identification. It lists well over 3,900 device codes in alphabetical order,
together with type numbers, device characteristics or equivalents and pinout
information |
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S M
N P introduction to surface mount nomenclature and packaging, pdf
file |
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Thermal and
electrical characteristics of semiconductor packages Mechanism of heat
dissipation, Classification of electrical noise, Four major influential factors
in thermal resistance, Different electrical requirements for different
applications, Thermal design of a package, Electrical characteristics of each
package |
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Horizontaal |
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Last updated on:
2011-01-02
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