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Horizontaal
Chip packaging technology  related topics: Soldering, Digital: technology, PCB fabrication
Applications for Silicone Materials in IC Packaging pdf file
Ball Grid Array Ball Grid Array, BGA
BGA Packages BGA Packages, pdf file
CSP Socket Primer
Chip packaging technology Wafer Level Chip Size Packaging Technology, pdf file
Dual In-Line Package Ceramic Dual-in-Line Package (Cerdip), pdf file
Electronic packaging Overview of Electronic Packaging, Semiconductor Packaging, Manufacturing of PWB's, Electrical Aspects of PCBs, Joining Methods in Electronics, Surface Mounting Technology, Quality Management in PWB Manufacture, PWB Design Process
IC logos IC logos, Identification of IC manufacturer by logo
IC Package Families
IC Package information DIP (Dual-in-line Package), SDIP (Skinny Dual-in-line Package), SDIP (Shrink Dual-in-line Package), ZIP (Zig-Zag In-line Package), SOP (Small Outline Package), SSOP (Shrink Small Outline Package), TSOP (Thin Small Outline Package), QFP (Quad Flat Package), LQFP (Low Profile Quad Flat Package), TQFP (Thin Quad Flat Package), SOJ (Small Outline J-lead), QFJ (Quad Flat J-lead), BGA (Ball Grid Array), FBGA (Fine Ball Grid Array), FLGA (Fine Land Grid Array), W-CSP (Wafer-level Chip Size Package), TCP (Tape Carrier Package)
IC packages data handbook Through-Hole Mount Packages, Surface Mount Packages,
IC Packaging Packaging the IC chip is a necessary step in the manufacturing process because the IC chips are small, fragile, susceptible to environmental damage, and too difficult to handle by the IC users. In addition, the package acts as a mechanism to “spread apart” the connections from the tight pitch (center to center spacing of two parallel conductors) on the IC die to the relatively wide pitch required by the Printed Circuit Board (PCB) manufacturer, pdf file
IC Packaging click right to See a demonstration on various features of IC Packaging design capabilities, Laminate BGA, Flex BGA, Chip Scale BGA, Enhanced or Cavity BGA, Wafer Scale BGA
IC packaging information IC packaging information, pdf file
IC packaging technology ppt file
IC packaging technology IC packaging technology, Area Array package, FBGA/FLGA, T-BGA, Enhanced P-BGA, P-BGA, Flat package, QFP, LQFP, TQFP, TSOP, TSSOP, HSOF, SOP, SSOP, SOJ, DIP, SIP, SZIP, SDIPIC packaging technology, pdf file
Intel packaging technology pdf file
Intel packaging technology An overview of package families, including package attributes, package types, and a package selection guide: FCBGA, PBGA MDDS, BGA, PGA MDDS, QFP MDDS, SOP MDDS, CSP, Chip Scale Packaging, Plastic Ball Grid Array package technology, Plastic Pin Grid Array package technology, and its physical structure, Tape Carrier Package, ESD/EOS precautions, Physical constants of IC package materials, pdf file
Intel Processor Package Type Guide There are several package types for Intel® processors. These different package types are illustrated below along with a brief explanation of how to easily identify them
Microelectronic design Silicon microelectronic fabrication process and packaging
Package information SAMSUNG Semiconductor products
Package outline drawings pdf file
Package Terminology
Package outline drawings BGA, DBS, DIL, DIP, DQFN, DHVQFN, DHXQFN, HBCC, HDIP, HSOP, HTSSOP, HUQFN, HVQFN, HVSON, HWQFN, HWSON, HXQFN, HXSON, LFBGA, LQFP, MicroPak™, NanoStar™, PicoGate, PLCC, QFP, QSOP, RBS, SIL, SO, SSOP-II, SSOP-III, TFBGA, TQFP, TSSOP-I, TSSOP-II, TVSOP, VFBGA, VSO, VSSOP, XQFN, XSON
Packages Index BGA (Ball Grid Array), CBGA (Ceramic), FCBGA, PBGA (Plastic), SBGA (w/Heatsink), CSP (Chip Scale Package), CSP BGA (Ball Grid Array), LFCSP (LeadFrame), LGA (Land Grid Array), Tape CSP BGA, WLCSP (Wafer Level), DIP (Dual Inline Package), CerDIP (Ceramic), CerDIP - Side or Bottom Brazed, DIP Gullwing Leads, Metal or Hybrid DIP, PDIP (Plastic), FlatPack, Ceramic Flat Package, QFP (Quad Flat Pack), CQFP (Ceramic), LQFP 1.4mm thick, LQFP w/heat sink, MQFP, MQFP - Thermally Enhanced, TQFP (Thin, 1.0mm), TQFP - Thermally Enhanced, SIP (Single Inline Package), SIP Horizontal Leads, SIP Vertical Leads, SOIC (Small Outline IC), PSOP (SOIC w/heatslug), SOIC (Narrow), SOIC (Wide), SOP (Small Outline Package), MSOP (micro-SOP), QSOP (25mil pitch), SSOP (Shrink SO), Thermally Enhanced [PSOP/2], TSSOP (Thin, 1.2mm), TSSOP_EP, SOT (Small Outline Transistor), SC-70, SOT-143, SOT-223, SOT-23, SOT-66, SOT-89, TSOT-23 (Thin, 0.9mm)
Packaging the importance of packaging (electrical and thermal), material, manufacturing and reliability issues in the design and manufacturing of electronic products
Semiconductor packaging pdf file
Semiconductor Packaging Assembly Technology pdf file
SMD marking codes SMD codebook: This HTML book is designed to provide an easy means of device identification. It lists well over 3,900 device codes in alphabetical order, together with type numbers, device characteristics or equivalents and pinout information
S M N P introduction to surface mount nomenclature and packaging, pdf file
Thermal and electrical characteristics of semiconductor packages Mechanism of heat dissipation, Classification of electrical noise, Four major influential factors in thermal resistance, Different electrical requirements for different applications, Thermal design of a package, Electrical characteristics of each package
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